Experience
Sr. Process Engineer @ Murata
Vantaa, Finland (2022 – Present)
Silicon-Glass Fusion Process Ownership
I manage product/process qualifications, optimization, cost reduction, and yield improvement projects. My role involves executing Engineering Change Notices (planning, validation, documentation, safe-launch, reporting) and ensuring robust process controls.
Key Responsibilities:
- Responsible for the silicon-glass fusion process — structural integrity and post-fusion workflows.
- Metrology tool controls (MSA, Gage R&R).
- Implementing process controls and continuous improvements (CI) to reduce variation.
- Leading root-cause investigations (FTA, 8D).
- Overseeing purchases and supplier quality projects.
- Financial assessments and ROI analyses.
My Impact (Data & AI):
- Digital Transformation: Spearheaded initiatives delivering end-to-end data solutions, from novel data-collection strategies to fully automated analytics.
- AI Integration: Developed novel process controls leveraging AI for predictive maintenance and smarter production workflows.
- Visualization: Created Power BI and JMP dashboards for enhanced analysis.
- Mentorship: Mentoring engineers in machine learning and deep-learning initiatives.
Manufacturing Processes
- Thermal glass-silicon fusion
- Edge grinding
- Edge profilometry
- Grinding
- Washing
- Etching processes
- Thermal relaxation processes
- Polishing processes
- Metrology tools
Data & AI Innovations
- Glass-silicon fusion data and AI solution
- Grinding process control via novel data innovations
- High-impact feasibility studies with significant cost-reduction potential
- Ownership and development of BI solutions
- Mentorship via Python
Thesis Worker @ Aalto University
Espoo, Finland (2021)
- Investigated the degradation of lithium-ion battery materials (NMC811 and graphite) for second-life applications.
- Conducted extensive material characterization and data analysis as part of a Business Finland commission.
Process Operator @ Okmetic
Vantaa, Finland (2012 – 2017)
- Began my career in a cleanroom environment specializing in Double-Sided Polishing (DSP) of semiconductor wafers.
- Operated precision equipment, performed maintenance, troubleshooting, and quality control.
- Utilized data to monitor processes and ensure quality standards were met.
- Expanded role to include Single-Sided Polishing (Okamoto XLSSP) and wafer sorting, contributing to process development and loss minimization.